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Danfoss丹佛斯新型体积更小的NVQD液冷快换接头专为英伟达GB300，Nvidia的第二代Blackwell B300 系列处理器开发。，英伟达计划在2025年年中推出BlackwellUltra GB300AI服务器，采用“全水冷”散热方案，并带来更强悍的性能。与现有的BlackwellGPU直接焊接到主板不同，BlackwellUltra将采用插槽式设计，用户可以像CPU一样自由安装或卸载GPU，这一改变简化了制造流程，对生产互连组件和插槽的制造商尤为有利。新一代 GB300 AI 服务器将采用“Blackwell Ultra”架构，由于性能显著提升，导致功耗也大幅增加，将取消风扇风冷版本将采用全液冷散热方案，全面采用液冷系统并以「液对液」方式为主，并且GB300CPU 及GPU 将改用插槽(Socket)设计，对液冷快接头需求将成倍递增，此前1台GB200 服务器机柜需要用到300 颗液冷快接头，预计GB300 机柜需要600 颗液冷快接头，液冷快接头市场将迎来成倍增长。 AI算力高需求加速芯片迭代，性能升级的同时功耗显著增长，同时带动数据中心单机柜功率增加，传统散热范围受限。英伟达GB200NVL36及NVL72整机柜的TDP（热设计功耗）甚至将高达70kW及近140kW，需要搭配水冷方案以有效解决散热问题。这表明，随着AI服务器功率的提升，对高效散热方案的需求也在不断增加。随着液冷技术的不断成熟和市场需求的增加，市场空间不断扩大，机构预计到2030年全球市场将达到213亿美元。英伟达明年的AI超级芯片出货目标为650万颗，其中GB200预计将占据70%的份额。随着GB200NVL36及NVL72整机柜的广泛应用，这些零部件的需求也将随之增加。
Danfoss NVQD液冷快换接头的液体冷却应用非常适合使用较小的软管线，有四种尺寸以及各种终端端和线程配置。可以使用两种颜色选项，以最大程度地减少错误连接的风险，同时减少组装和维护时间。此外，对液冷快换接头进行了设计，可以通过按向连接的设计和一流的连接力来更快，更轻松地维护，这两者都可以与一只手相处方便，无工具连接和断开连接。 Danfoss NVQD液冷快换接头由带有EPDM橡胶密封的不锈钢制成，具有高腐蚀性和宽阔的流体兼容性。借助平面干式设计，Danfoss NVQD液冷快换接头非常适合用于高度关键的应用程序，该应用需要100％的正常运行时间和无泄漏操作。作为另一种安全措施，每个液冷快换接头都是氦泄漏测试。 NVQD液冷快换接头提供的流量比开放式项目社区标准和低压下降的流量高25％。他们一流的性能提高了系统效率并降低了内置功率 消费，使数据中心运营商能够从长期的成本节省中受益。在量化的竞争结果中，Danfoss NVQD液冷快换接头在流动和压力下降性能方面的表现优于行业标准等效的IP产品25％。 “根据数十年的工程经验，这些新的NVQD液冷快换接头补充了Danfoss的长期领先源线液冷快换接头，FD83和各种液体冷却软管，从而支持我们作为流体运输系统解决方案提供商的策略。” Danfoss Power Solutions产品经理Amanda Bryant说。 “它们使我们的客户能够建立可靠，完整的热管理解决方案，以确保员工和设备安全，同时最大程度地提高性能和长期价值。”
Danfoss New NVQD Couplings Ideal for Data Center Rack Applications Danfoss has developed a new, smaller NVQD liquid cooled quick change connector specifically for Nvidia GB300 and Nvidia's second-generation Blackwell B300 series processors., Nvidia plans to launch the "Blackwell Ultra" GB300AI server in mid-2025, which will adopt a "fully water-cooled" cooling solution and bring more powerful performance. Unlike the existing Blackwell GPU that is directly soldered to the motherboard, Blackwell Ultra will adopt a slot based design, allowing users to freely install or uninstall GPUs like CPUs. This change simplifies the manufacturing process and is particularly beneficial for manufacturers producing interconnect components and slots. The new generation GB300 AI server will adopt the "Blackwell Ultra" architecture. Due to significant performance improvements, power consumption has also increased significantly. The fan air-cooled version will be cancelled and a fully liquid cooled cooling solution will be adopted, with a liquid cooling system and a "liquid to liquid" approach as the main approach. The GB300 CPU and GPU will be designed with sockets, and the demand for liquid cooled quick connectors will increase exponentially. Previously, one GB200 server cabinet required 300 liquid cooled quick connectors, and it is expected that the GB300 cabinet will require 600 liquid cooled quick connectors, leading to a significant growth in the liquid cooled quick connector market. The high demand for AI computing power accelerates chip iteration, leading to a significant increase in power consumption while upgrading performance. At the same time, it drives an increase in the power of single cabinets in data centers, limiting the traditional heat dissipation range. The TDP (thermal design power consumption) of the Nvidia GB200NVL36 and NVL72 cabinets can even reach up to 70kW and nearly 140kW, requiring a water cooling solution to effectively solve the heat dissipation problem. This indicates that as the power of AI servers increases, the demand for efficient cooling solutions is also constantly increasing. With the continuous maturity of liquid cooling technology and the increasing market demand, the market space is constantly expanding, and institutions expect the global market to reach 21.3 billion US dollars by 2030. Nvidia's AI supercomputer shipment target for next year is 6.5 million units, of which GB200 is expected to account for 70% of the market share. With the widespread application of GB200NVL36 and NVL72 whole cabinets, the demand for these components will also increase. Danfoss’ new Universal Quick Disconnect (NVQD) couplings provide superior performance and reliability for liquid cooling, ensuring peak performance for critical applications. Engineered for the precision cooling requirements of modern data centers, the couplings drive a strong return on investment through robust design, long service life and lower maintenance. Ideal for liquid cooling applications that use smaller hose lines, Danfoss NVQD couplings are available in four sizes, as well as various terminal ends and thread configurations. Two color options are available to minimize the risk of misconnection while reducing assembly and maintenance time. In addition, the couplings are engineered to enable quicker and easier maintenance with a push-to-connect design and best-in-class force to connect, both of which allow for convenient, tool-free connection and disconnection with one hand. Constructed from stainless steel with an EPDM rubber seal, Danfoss NVQD couplings offer high corrosion resistance and broad fluid compatibility. With a flat face dry-break design, Danfoss NVQD couplings are ideal for use in highly critical applications that demand 100% uptime and leak-free operation. As an additional safety measure, every coupling is helium leak tested. NVQD couplings provide a 25% higher flow rate than Open Compute Project community standards and a low pressure drop. Their best-in-class performance improves system efficiency and reduces in-rack power consumption, enabling data center operators to benefit from long-term cost savings. In quantified competitive results, Danfoss NVQD couplings outperform industry standard equivalent and competitor IP products when it comes to flow and pressure drop performance by 25%. “Based on decades of engineering experience, these new NVQD couplings complement Danfoss’ longstanding leading source line coupling, the FD83, and various liquid cooling hoses, supporting our strategy as a fluid conveyance system solution provider.” said Amanda Bryant, product manager, Danfoss Power Solutions. “They enable our customers to build reliable and complete thermal management solutions that keep staff and equipment safe, while maximizing performance and long-term value.”
关于我们 北京汉深流体技术有限公司 是丹佛斯中国数据中心签约代理商。产品包括FD83全流量双联锁液冷快换接头（互锁球阀）；液冷通用快速接头UQD & UQDB；OCP ORV3盲插快换接头BMQC；EHW194 EPDM液冷软管、电磁阀、压力和温度传感器。在国家数字经济、东数西算、双碳、新基建战略的交汇点，公司聚焦组建高素质、经验丰富的液冷工程师团队，为客户提供卓越的工程设计和强大的客户服务。 公司产品涵盖：丹佛斯液冷流体连接器、EPDM软管、电磁阀、压力和温度传感器及Manifold。 - 针对机架式服务器中Manifold/节点、CDU/主回路等应用场景，提供不同口径及锁紧方式的手动和全自动快速连接器。
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